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OIP / Government Intelligence / Opportunity detail
Source: Stored live-derived Government dataMisty L Roosa Management Analyst
OIP derived this review page from stored live-derived Government Intelligence source records. The official source and issuing agency remain authoritative.
Opportunity Intelligence Platform is an independent service and is not affiliated with or endorsed by the U.S. Government. Official notices, amendments, attachments, eligibility requirements, funding terms, and deadlines remain under source control.
OIP scores and explanations are informational and do not guarantee eligibility, suitability, compliance, contract award, or financial outcome.
No funding amount is disclosed in the stored source fields.
Others (see text field entitled "Additional Information on Eligibility" for clarification)
2 warning(s) require review.
Objective score, derived by OIP
Publication decision: Publish with warning
CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment -- a Cooperative Agreement (Cooperative Agreement) issued by Misty L Roosa Management Analyst.
Objective Government score 66 for grants-gov-350338, computed from source evidence and Government scoring configuration.
potential_value (not_applicable): potential_value is structurally not applicable for this Government category. novelty (insufficient_evidence): novelty could not be scored: no current Government source provides a reliable per-record signal for whether an opportunity is genuinely novel versus long-standing.
14 evidence record(s) support this pipeline result.
Next action: Review the official Grants.gov opportunity and follow the listed application package instructions.
86/100 · Ok
evidence_quality reflects a federal-source baseline plus completeness of deadline, funding value, eligibility, and official-source fields on this specific record.
75/100 · Ok
confidence reflects OIP's confidence in its own interpretation of this record's lifecycle and funding-value status, not confidence that any applicant will qualify.
No numeric value · Not Applicable
potential_value is structurally not applicable for this Government category.
62/100 · Ok
urgency reflects the number of days remaining until the disclosed application deadline.
70/100 · Ok
difficulty reflects this opportunity's cooperative-agreement funding instrument, which typically involves substantial federal involvement and negotiation.
55/100 · Ok
time_required reflects the coordination and negotiation overhead typical of a cooperative-agreement funding instrument.
55/100 · Ok
capital_required reflects that cooperative agreements often require applicant cost-sharing as a matter of federal funding-mechanism convention; confirm the exact requirement in the official notice.
60/100 · Ok
risk reflects the number of material evidence gaps on this record (undisclosed value, missing deadline, unlisted eligibility, or a stale source date), not ordinary competitive uncertainty.
CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment
$.detail.opportunityTitle · Field Mapping · 98/100 confidence
350338 / 2023-NIST-CHIPS-SMME-01
$.detail.id · Field Mapping · 99/100 confidence
Misty L Roosa Management Analyst
$.detail.synopsis.agencyName · Field Mapping · 97/100 confidence
Cooperative Agreement
$.detail.synopsis.fundingInstruments · Field Mapping · 96/100 confidence
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment. For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov . If you have any questions on how to apply, please email apply@chips.gov.
$.detail.synopsis.synopsisDesc · Field Mapping · 94/100 confidence
2023-09-29T04:00:00.000Z
$.detail.synopsis.postingDate · Field Mapping · 96/100 confidence
2026-11-01T00:00:00.000Z
$.searchHit.closeDate · Field Mapping · 92/100 confidence
Applicant types: Others (see text field entitled "Additional Information on Eligibility" for clarification)
$.detail.synopsis.applicantTypes · Field Mapping · 94/100 confidence
value_not_disclosed
$.detail.synopsis · Field Mapping · 84/100 confidence
2025-10-16T22:17:20.000Z
$.detail.synopsis.lastUpdatedDate · Field Mapping · 88/100 confidence
Official source materials control eligibility, deadlines, amendments, attachments, and funding terms.
Open official sourceNo numeric value · Insufficient Evidence
novelty could not be scored: no current Government source provides a reliable per-record signal for whether an opportunity is genuinely novel versus long-standing.
2023-NIST-CHIPS-SMME-01-Amendment.pdf
$.detail.synopsisAttachmentFolders[1].synopsisAttachments[0] · Field Mapping · 90/100 confidence
CHIPS - Facilities for Semiconductor Materials and Manufacturing Equipment NOFO.pdf
$.detail.synopsisAttachmentFolders[0].synopsisAttachments[0] · Field Mapping · 90/100 confidence
Review official application document: 2023-NIST-CHIPS-SMME-01-Amendment.pdf.
$.detail.synopsisAttachmentFolders[1].synopsisAttachments[0] · Field Mapping · 78/100 confidence
Verify application requirements in official NOFO: CHIPS - Facilities for Semiconductor Materials and Manufacturing Equipment NOFO.pdf.
$.detail.synopsisAttachmentFolders[0].synopsisAttachments[0] · Field Mapping · 78/100 confidence